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Nanoporous Silicon Prepared by Vapour Phase Strain Etch and Sacrificial Technique

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IJCA Proceedings on International Conference on Microelectronic Circuit and System
© 2015 by IJCA Journal
MICRO 2015 - Number 1
Year of Publication: 2015
Authors:
Binoy Bera

Binoy Bera. Article: Nanoporous Silicon Prepared by Vapour Phase Strain Etch and Sacrificial Technique. IJCA Proceedings on International Conference on Microelectronic Circuit and System MICRO 2015(1):42-45, December 2015. Full text available. BibTeX

@article{key:article,
	author = {Binoy Bera},
	title = {Article: Nanoporous Silicon Prepared by Vapour Phase Strain Etch and Sacrificial Technique},
	journal = {IJCA Proceedings on International Conference on Microelectronic Circuit and System},
	year = {2015},
	volume = {MICRO 2015},
	number = {1},
	pages = {42-45},
	month = {December},
	note = {Full text available}
}

Abstract

Porous silicon nanoparticles is a excellent candidates for medical applications as drug delivery devices, for their excellent biocompatibility, biodegradability, and high surface area. In this paper the simple fabrication process of porous silicon by vapour phase strain etch has been observed. The porous silicon nanoparticle has been made by sacrificial technique. This paper also presents the methods of fabrication of porous silicon nanoparticle and measurement of its particle size by dynamic light scattering. Porosity and thickness of porous silicon has been observed by using gravimetric method. Polydispersity index of the dls sample is 0. 22.

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