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Thermal Analysis of Active Electronic Component with Thermal Imaging

IJCA Proceedings on National Conference on Electronics and Computer Engineering
© 2016 by IJCA Journal
NCECE 2016 - Number 1
Year of Publication: 2016
Shrikant Akole
Vinayak B. Kulkarni

Shrikant Akole and Vinayak B Kulkarni. Article: Thermal Analysis of Active Electronic Component with Thermal Imaging. IJCA Proceedings on National Conference on Electronics and Computer Engineering NCECE 2016(1):11-15, April 2016. Full text available. BibTeX

	author = {Shrikant Akole and Vinayak B. Kulkarni},
	title = {Article: Thermal Analysis of Active Electronic Component with Thermal Imaging},
	journal = {IJCA Proceedings on National Conference on Electronics and Computer Engineering},
	year = {2016},
	volume = {NCECE 2016},
	number = {1},
	pages = {11-15},
	month = {April},
	note = {Full text available}


Any electronic circuit is a combination of various components. These electronic components can be categorized in two types viz. as Passive components and active components. Active components changes or add gain to the input energy. Whereas, active components need assistance of passive components. In electronic circuits, heat is the resultant of energy gain provided by active electronic components. This heat generated can cause harmful effects to the circuitry and permanent damage to the device. Because of this, component selection is crucial part in designing. Moreover, predicting thermal behavior of component at any specific operating condition is equally important. There are several methods adopted till date for this cause but very countable among them are reliable and have ease in use. For the same, thermal images of components can be used to derive solution on such critical problem. Generally, to address this, tedious mathematics and formulations are carried out. With advanced thermal image processing techniques, this can be simplified to greater extent.


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