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Reseach Article

Thermal Analysis of Active Electronic Component with Thermal Imaging

Published on April 2016 by Shrikant Akole, Vinayak B. Kulkarni
National Conference on Electronics and Computer Engineering
Foundation of Computer Science USA
NCECE2016 - Number 1
April 2016
Authors: Shrikant Akole, Vinayak B. Kulkarni
2d01affe-d224-489b-bffb-1ac79ebc0527

Shrikant Akole, Vinayak B. Kulkarni . Thermal Analysis of Active Electronic Component with Thermal Imaging. National Conference on Electronics and Computer Engineering. NCECE2016, 1 (April 2016), 11-15.

@article{
author = { Shrikant Akole, Vinayak B. Kulkarni },
title = { Thermal Analysis of Active Electronic Component with Thermal Imaging },
journal = { National Conference on Electronics and Computer Engineering },
issue_date = { April 2016 },
volume = { NCECE2016 },
number = { 1 },
month = { April },
year = { 2016 },
issn = 0975-8887,
pages = { 11-15 },
numpages = 5,
url = { /proceedings/ncece2016/number1/24660-9513/ },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Proceeding Article
%1 National Conference on Electronics and Computer Engineering
%A Shrikant Akole
%A Vinayak B. Kulkarni
%T Thermal Analysis of Active Electronic Component with Thermal Imaging
%J National Conference on Electronics and Computer Engineering
%@ 0975-8887
%V NCECE2016
%N 1
%P 11-15
%D 2016
%I International Journal of Computer Applications
Abstract

Any electronic circuit is a combination of various components. These electronic components can be categorized in two types viz. as Passive components and active components. Active components changes or add gain to the input energy. Whereas, active components need assistance of passive components. In electronic circuits, heat is the resultant of energy gain provided by active electronic components. This heat generated can cause harmful effects to the circuitry and permanent damage to the device. Because of this, component selection is crucial part in designing. Moreover, predicting thermal behavior of component at any specific operating condition is equally important. There are several methods adopted till date for this cause but very countable among them are reliable and have ease in use. For the same, thermal images of components can be used to derive solution on such critical problem. Generally, to address this, tedious mathematics and formulations are carried out. With advanced thermal image processing techniques, this can be simplified to greater extent.

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Index Terms

Computer Science
Information Sciences

Keywords

Color Histogram Thermal Analysis Thermal Image Processing Feature Extraction Thermal Management Contactless Temperature Measurement