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Reseach Article

Analysis, Design and Optimization of On-Chip Inductors On Sapphire for Gan Based RFICs

Published on September 2015 by Divya S.
National Conference “Electronics, Signals, Communication and Optimization"
Foundation of Computer Science USA
NCESCO2015 - Number 1
September 2015
Authors: Divya S.
86ca2698-2645-4771-aa5b-2f3ba35b821c

Divya S. . Analysis, Design and Optimization of On-Chip Inductors On Sapphire for Gan Based RFICs. National Conference “Electronics, Signals, Communication and Optimization". NCESCO2015, 1 (September 2015), 36-41.

@article{
author = { Divya S. },
title = { Analysis, Design and Optimization of On-Chip Inductors On Sapphire for Gan Based RFICs },
journal = { National Conference “Electronics, Signals, Communication and Optimization" },
issue_date = { September 2015 },
volume = { NCESCO2015 },
number = { 1 },
month = { September },
year = { 2015 },
issn = 0975-8887,
pages = { 36-41 },
numpages = 6,
url = { /proceedings/ncesco2015/number1/22298-5308/ },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Proceeding Article
%1 National Conference “Electronics, Signals, Communication and Optimization"
%A Divya S.
%T Analysis, Design and Optimization of On-Chip Inductors On Sapphire for Gan Based RFICs
%J National Conference “Electronics, Signals, Communication and Optimization"
%@ 0975-8887
%V NCESCO2015
%N 1
%P 36-41
%D 2015
%I International Journal of Computer Applications
Abstract

The on chip spiral inductors are one of the key components in the development of the RFIC's as they determine the performance of the circuits such as VCO, LNA, mixers etc. In this paper, the design of an inductor for GaN based RFICs operating in C-band is presented. Sapphire (Al2O3), which is a common substrate for GaN, is used as substrate and silicon nitride (Si3N4), which is a common passivation layer in GaN technology, is used as insulator layer between the metal layers. While the use of Al2O3 alleviates the problem of substrate losses that are common in Si substrate, use of Si3N4 increases the inter-metal layer capacitance. IE3D EM simulation tool was used for the design and optimization of the spiral inductors. An inductor of 5 nH operating at 5 GHz has been designed and optimized to achieve high quality factor (Q) in low foot print. Finally a parallel LC resonant tank circuit was designed to resonate at 5 GHz to demonstrate the operation of the designed inductor.

References
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Index Terms

Computer Science
Information Sciences

Keywords

Rfics On Chip Inductor Quality Factor Foot Print Self-resonance Frequency.