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Thermal Uniformity-Aware Application Mapping for Network-on-Chip Design

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International Journal of Computer Applications
© 2014 by IJCA Journal
Volume 99 - Number 3
Year of Publication: 2014
Authors:
Pradip Kumar Sahu
Kanchan Manna
Tapan Shah
Santanu Chattopadhyay
10.5120/17351-7838

Pradip Kumar Sahu, Kanchan Manna, Tapan Shah and Santanu Chattopadhyay. Article: Thermal Uniformity-Aware Application Mapping for Network-on-Chip Design. International Journal of Computer Applications 99(3):8-22, August 2014. Full text available. BibTeX

@article{key:article,
	author = {Pradip Kumar Sahu and Kanchan Manna and Tapan Shah and Santanu Chattopadhyay},
	title = {Article: Thermal Uniformity-Aware Application Mapping for Network-on-Chip Design},
	journal = {International Journal of Computer Applications},
	year = {2014},
	volume = {99},
	number = {3},
	pages = {8-22},
	month = {August},
	note = {Full text available}
}

Abstract

Ensuring thermal-uniformity in an integrated circuit chip is very essential for its correct operation. Thus, in the Network-on-Chip (NoC) based system design as well, it is essential to attach cores of the application core graph to the routers in the topology graph so that thermal uniformity across the chip is maintained. However, the performance of the application should not be sacrificed to a great extent. Also, the CPU time needed to explore the overall search-space is quite high. This paper presents a tool to the designers to explore the search-space in a controlled fashion. The designer can specify the communication cost degradation that can be tolerated and the amount of effort put in to identify the potential solutions. All non-dominated solutions (in terms of communication cost and temperature variance) are reported from which the designer can choose the appropriate one for implementation.

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