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Hetero Double Gate-dielectric Tunnel FET with record high ION/ IOFF ratio

Published on None 2011 by Brinda Bhowmick, S. Baishya
International Conference on VLSI, Communication & Instrumentation
Foundation of Computer Science USA
ICVCI - Number 4
None 2011
Authors: Brinda Bhowmick, S. Baishya
15880e92-63d9-45f2-b9d9-9138b9ef1d13

Brinda Bhowmick, S. Baishya . Hetero Double Gate-dielectric Tunnel FET with record high ION/ IOFF ratio. International Conference on VLSI, Communication & Instrumentation. ICVCI, 4 (None 2011), 11-13.

@article{
author = { Brinda Bhowmick, S. Baishya },
title = { Hetero Double Gate-dielectric Tunnel FET with record high ION/ IOFF ratio },
journal = { International Conference on VLSI, Communication & Instrumentation },
issue_date = { None 2011 },
volume = { ICVCI },
number = { 4 },
month = { None },
year = { 2011 },
issn = 0975-8887,
pages = { 11-13 },
numpages = 3,
url = { /proceedings/icvci/number4/2650-1218/ },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Proceeding Article
%1 International Conference on VLSI, Communication & Instrumentation
%A Brinda Bhowmick
%A S. Baishya
%T Hetero Double Gate-dielectric Tunnel FET with record high ION/ IOFF ratio
%J International Conference on VLSI, Communication & Instrumentation
%@ 0975-8887
%V ICVCI
%N 4
%P 11-13
%D 2011
%I International Journal of Computer Applications
Abstract

To manage the increasing static leakage in low power applications and reduced Ion/Ioff due to aggressive scaling of MOS transistors, Tunnel FET (TFET) devices are considered as the most promising candidates because of their excellent immunity against such important short channel effects. Solutions for leakage reduction as well as improving on current of the device are sought at the device design and process technology levels. In this paper, we propose a novel design for a hetero double gate dielectric tunnel field effect transistor (HDG-TFET). Simulation of this device characteristics show significant improvement over conventional double gate devices with high K only gate dielectric TFET. In this device, a low K gate oxide is used at the drain end and a high K gate oxide is used at the source end with low band gap material in source region. Ambipolar behavior at the drain end can be suppressed and a record high Ion/Ioff of the order of 10 13 is achieved.

References
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Index Terms

Computer Science
Information Sciences

Keywords

AMBIPOLAR TRANSPORT HETRO-GATE-DIELECTRIC BAND-TO-BAND TUNNELING