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Reseach Article

Effect of Pulse Reverse Plating Using Silver On Printed Circuit Boards

Published on March 2012 by S. Jayapoorani, Dalim Kumar Ghosh
International Conference and Workshop on Emerging Trends in Technology
Foundation of Computer Science USA
ICWET2012 - Number 10
March 2012
Authors: S. Jayapoorani, Dalim Kumar Ghosh
0c103fcf-4f92-4a84-8a20-c00b3f8b98b7

S. Jayapoorani, Dalim Kumar Ghosh . Effect of Pulse Reverse Plating Using Silver On Printed Circuit Boards. International Conference and Workshop on Emerging Trends in Technology. ICWET2012, 10 (March 2012), 25-27.

@article{
author = { S. Jayapoorani, Dalim Kumar Ghosh },
title = { Effect of Pulse Reverse Plating Using Silver On Printed Circuit Boards },
journal = { International Conference and Workshop on Emerging Trends in Technology },
issue_date = { March 2012 },
volume = { ICWET2012 },
number = { 10 },
month = { March },
year = { 2012 },
issn = 0975-8887,
pages = { 25-27 },
numpages = 3,
url = { /proceedings/icwet2012/number10/5387-1078/ },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Proceeding Article
%1 International Conference and Workshop on Emerging Trends in Technology
%A S. Jayapoorani
%A Dalim Kumar Ghosh
%T Effect of Pulse Reverse Plating Using Silver On Printed Circuit Boards
%J International Conference and Workshop on Emerging Trends in Technology
%@ 0975-8887
%V ICWET2012
%N 10
%P 25-27
%D 2012
%I International Journal of Computer Applications
Abstract

Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness distribution in the hole is an important factor in double sided and also multilayered PCB . Here the plating process is carried using pulse reverse plating on the printed circuit board . Pulse Reverse Electroplating is similar to DC plating but it has a square wave along with a periodic reverse current.[1]In periodic reverse current process a layer is produced on the cathode surface with a lower metal Concentration. Periodic reverse current help to obtain a plating thickness which is uniform in nature and also in nano structured grain size which results in high binding of the metal with the substrate

References
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Index Terms

Computer Science
Information Sciences

Keywords

Pulse reverse plating PCB silver Nanostructured coating current density