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A Comparative Analysis of Single Walled CNT Bundle and Multi Walled CNT as Future Global VLSI Interconnects

Evolution in Networks and Computer Communications
© 2011 by IJCA Journal
Number 2 - Article 6
Year of Publication: 2011
Manoj Kumar Majumder
B. K. Kaushik
S. K. Manhas

Manoj Kumar Majumder K Kaushik and S K Manhas. A Comparative Analysis of Single Walled CNT Bundle and Multi Walled CNT as Future Global VLSI Interconnects. IJCA Special Issue on Evolution in Networks and Computer Communications (2):32-38, 2011. Full text available. BibTeX

	author = {Manoj Kumar Majumder andB. K. Kaushik and S. K. Manhas},
	title = {A Comparative Analysis of Single Walled CNT Bundle and Multi Walled CNT as Future Global VLSI Interconnects},
	journal = {IJCA Special Issue on Evolution in Networks and Computer Communications},
	year = {2011},
	number = {2},
	pages = {32-38},
	note = {Full text available}


Carbon based nanomaterials such as metallic single walled carbon nanotubes (SWNT), multi-wall carbon nanotubes (MWNT), and graphene have been considered as some of the most promising candiadates for future interconnect technology. In current deep sub-micron level technology, MWNTs have potentially provided an attractive solution over SWNT bundles. This paper presents a comprehensive analysis of propagation delay for both MWNT and SWNT bundles at different interconnect lengths (global) and shows a comparison of area for equivalent number of SWNTs in bundle and shells in MWNTs. It has been observed that irrespective of the type of CNTs, propagation delay increases with interconnect lengths. For same propagation delay performance, the area occupied by SWNT bundle is more than the MWNTs for a specified interconnect length.


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