CFP last date
20 May 2024
Reseach Article

Reduction of Power Dissipation in Logic Circuits

by Sreenivasa Rao Ijjada, B.Ramparamesh, Dr. V.Malleswara Rao
International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 24 - Number 6
Year of Publication: 2011
Authors: Sreenivasa Rao Ijjada, B.Ramparamesh, Dr. V.Malleswara Rao
10.5120/2962-3946

Sreenivasa Rao Ijjada, B.Ramparamesh, Dr. V.Malleswara Rao . Reduction of Power Dissipation in Logic Circuits. International Journal of Computer Applications. 24, 6 ( June 2011), 10-14. DOI=10.5120/2962-3946

@article{ 10.5120/2962-3946,
author = { Sreenivasa Rao Ijjada, B.Ramparamesh, Dr. V.Malleswara Rao },
title = { Reduction of Power Dissipation in Logic Circuits },
journal = { International Journal of Computer Applications },
issue_date = { June 2011 },
volume = { 24 },
number = { 6 },
month = { June },
year = { 2011 },
issn = { 0975-8887 },
pages = { 10-14 },
numpages = {9},
url = { https://ijcaonline.org/archives/volume24/number6/2962-3946/ },
doi = { 10.5120/2962-3946 },
publisher = {Foundation of Computer Science (FCS), NY, USA},
address = {New York, USA}
}
%0 Journal Article
%1 2024-02-06T20:10:15.768806+05:30
%A Sreenivasa Rao Ijjada
%A B.Ramparamesh
%A Dr. V.Malleswara Rao
%T Reduction of Power Dissipation in Logic Circuits
%J International Journal of Computer Applications
%@ 0975-8887
%V 24
%N 6
%P 10-14
%D 2011
%I Foundation of Computer Science (FCS), NY, USA
Abstract

The most research on the power consumption of circuits has been concentrated on the switching power and the power dissipated by the leakage current has been relatively minor area. In today’s IC design, one of the key challenges is the increase in power dissipation of the circuit which in turn shortens the service time of battery-powered electronics, reduces the long-term reliability of circuits due to temperature-induced accelerated device and interconnects aging processes, and increases the cooling and packaging costs of these circuits. In this paper the main aim is to reduce power dissipation. A new design method for various logical circuits design, which is low power, compared to general Static CMOS logic. In this technique both NMOS transistor and PMOS transistors in various logic circuits is split into two transistors. Leakage current flowing through the NMOS transistor stack reduces due to the increase in the source to substrate voltage in the top NMOS transistor and also due to an increase in the drain to source voltage in the bottom NMOS transistor Leakage current flowing through the PMOS transistor stack reduces due to the increase in the source to substrate voltage in the top PMOS transistor and also due to an increase in the drain to source voltage in the bottom NMOS transistor. The tool used is TANNER EDA for schematic simulation. The simulation technology used is MOSIS 180nm.

References
  1. 2007 International Technology Roadmap for Semiconductors,
  2. online Available http://public.itrs.net.
  3. J.Abraham, “Overcoming timing, power bottlenecks,” EE Times, April 2003.
  4. P. Elakkumanan, C. Thondapu, and R. Sridhar, “A Gate Leakage Reduction Strategy for Sub-70nm Memory Circuit,” in Proceedings of 2004 IEEE Dallas/CAS Workshop, 2004, pp. 145-148.
  5. Z. Chen, M. Johnson, L. Wei and K. Roy, ‘Estimation of Standby Leakage Power in CMOS Circuits Considering Accurate Modelling of Transistor Stacks,’ International Symposium on low Power Electronics and Design, pp. 239-244, August 1998.
  6. S. Dutta, S. Nag, K. Roy, “ASAP: A Transistor Sizing tool for speed, area, and power optimization of static CMOS circuits”, IEEE International Symposium on Circuits and Systems, pp. 61-64, June, 1994
  7. N. Azizi and F.N. Najm, “An Asymmetric SRAM cell to lower gate leakage,” in Proceedings of 5th IEEE International Symposium on Quality Electronic Design, 2004, pp. 534-539.
  8. J.Rabaey, “Digital Integrated Circuits, A Design Perspective”, Prentice Hall, Upper Saddle River, NJ, 1996.
  9. K. Roy and S. C. Prasad, “Low-Power CMOS VLSI Circuit Design”, Wiley Publishers, New York, 2000.
  10. B. Yu et al., “Limits of gate oxide scaling in nano-transistors,” in Proceedings of Symposium on VLSI Technology, pp. 90-91, 2000
  11. “Low Power CMOS Inverter design at different Technologies” International journal of applied engineering research, Dindigul Volume 1, No 3, 201010. “Low Power CMOS Inverter design at different Technologies” International journal of applied engineering research, Dindigul Volume 1, No 3, 2010
  12. M. C. Johnson, D. Somasekhar, L. Y. Chiou, and K. Roy, “Leakage control with efficient use of transistor stacks in single threshold CMOS,” IEEE Trans. VLSI Syst., vol. 10, pp. 1–5, Feb. 2002
  13. C. Gopalakrishnan and S. Katkoori, “Resource allocation and binding approach for low leakage power,” in Proc. IEEE Int. Conf. VLSI Design, Jan. 2003, pp. 297–302
  14. S. Narendra, S. Borkar, V. De, D. Antoniadis, and A. P. Chandrakasan, “Scaling of stack effect and its application for leakage reduction,” Proc. IEEE ISLPLED, pp. 195–200, Aug. 2001.
  15. J. Kao, A. Chandrakasan, and D. Antoniadis, “Transistor sizing issues and tool for multi-threshold CMOS technology,” in Proc. 34th DAC, 1997, pp. 409–414.
Index Terms

Computer Science
Information Sciences

Keywords

Stack 6T SRAM cell low power threshold voltage